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|Cold Plate Material
||Copper Micro Fin|
||AMD AM2, AMD AM3, AMD FM1, Intel LGA 1155, Intel LGA 1156, Intel LGA 1366, Intel LGA 2011|
|Tubing||Low Evaporation Rubber|
||120mm x 152mm x 27mm|
||120mm x 120mm x 25mm|
||2000 RPM +/- 10%|
|Fan Static Pressure
- Self-contained cooling system - Serious liquid cooling for high-performance CPUs no longer means dealing with complex plumbing. Hydro Series H60 comes pre-filled, and never needs refilling or priming.
- Tool-free magnetic multiplatform mounting bracket kit - The modular design makes installation simpler, and it's compatible with Intel and AMD processors.
- Large-diameter, low permeability tooling - Minimal coolant evaporation helps ensure long life, and the flexible design gives you better leak protection and makes installation easier in tight spaces.
- Copper cold plate with pre-applied thermal compound - Copper has better thermal conductivity for more efficient heat transfer to the manifold. Pre-applied thermal compound lets you save a potentially messy installation step.