Noctua NT-H1 Thermal Compound Review

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Published on Wednesday, 04 November 2009 00:00

Written by Tom Burdak -GOMD-

I must say that one of my least favorite experiences in working with computers is the mess associated with thermal paste. Every time that I need to work on a system upgrade or build, I always dread the messy experience of cleaning of old paste and applying the new paste. It really is a rather annoying experience that is so simple in theory, yet quite frustrating in practice. It’s a necessary evil, so it better perform well.

Noctua has been a long standing manufacturer who keeps our systems running cool under heavy performance and use. Their heatsinks have produced excellent results during benchmarking and don’t crack under the pressure of heavy overclocking. With a great track record such as this, one can only wonder how their other cooling products perform, including our topic of necessary evils.

The Noctua NT-H1 thermal compound provides a secure thermal bond between the heatsink contact base and the CPU die. The Noctua NT-H1 thermal compound is a hybrid compound that produces high levels of thermal cooling with no electrical conduction. The lack of burn in time and the easy clean up only adds to the list of potential benefits to using the Noctua NT-H1 thermal paste.